The Ryzen AI 300 series is available in two versions: the Ryzen AI 9 HX 370 and the Ryzen AI 9 365, differentiated by core counts, clock speeds, and integrated GPU capabilities. AMD claims its 3rd Gen Ryzen AI or XDNA 2 generates 50 TOPS from the NPU alone, outclassing the 16 TOPS of the earlier Ryzen 8040, the 38 TOPS of the Apple M4, and the 45 TOPS of Qualcomm’s Snapdragon X Elite. AMD also claims that its chip will outperform a Snapdragon X Elite in terms of performance, and that it can outperform the Intel Core Ultra 185H in gaming.
Key takeaways:
- AMD is set to enter the Copilot+ generation of PCs with its new Ryzen AI 300 series, a mobile processor with an NPU that AMD claims will lead the industry with 50 TOPS of AI power.
- The Ryzen AI 300 series is AMD’s first Zen 5 processor, featuring double-digit performance gains compared to the previous generation and a robust integrated GPU.
- AMD is offering two new Ryzen AI 300 chips, the Ryzen AI 9 HX 370 and the Ryzen AI 9 365, differentiated by the number of core counts, clock speeds, and the capabilities of the integrated GPU.
- AMD claims that its chip will outperform a Snapdragon X Elite in terms of performance and the lack of a need for emulation, and it is expected to outperform the older Intel Core Ultra 185H.