In addition to this project, Cerebras is involved in DARPA's DRBE program, which focuses on creating a virtual environment for testing wireless communications systems. This involves building a radio frequency emulation supercomputer. Furthermore, Cerebras is constructing six new data centers equipped with its WSE-3 processors, featuring thousands of CS-3 compute appliances. These initiatives underscore Cerebras' commitment to advancing AI and computing technologies in collaboration with DARPA.
Key takeaways:
- Cerebras Systems has secured a $45 million contract from DARPA to develop a high-performance computing system integrating its WSE-3 chip with Ranovus' co-packaged optics technology.
- The WSE-3 chip, optimized for AI workloads, features 4 trillion transistors and 900,000 cores, with a 44-gigabyte pool of onboard SRAM memory, offering a more power-efficient alternative to traditional graphics cards.
- Co-packaged optics technology from Ranovus will be used to link multiple WSE-3 chips, enhancing AI cluster efficiency and network capacity by integrating transceivers directly into processors.
- In addition to the DARPA contract, Cerebras is involved in the DRBE program to create a virtual environment for testing wireless communications and is building six new data centers equipped with its WSE-3 processors.