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Chip packaging is the next battleground for tech lead: CEO, Cadence Design Systems

Sep 21, 2023 - auto.economictimes.indiatimes.com
Cadence Design Systems Inc. CEO, Anirudh Devgan, has urged the US to invest more in advanced semiconductor packaging to maintain its lead in emerging technologies such as artificial intelligence. He highlighted the importance of 3D-IC technology, which involves stacking chiplets into a multifunctional 3D chip, as a way to advance capabilities as the pursuit of smaller transistors reaches physical limits. Devgan also noted that the US doesn't need to own a fabrication plant to do packaging, as chips from different fabs can be assembled.

The CEO's comments come in the wake of Nvidia Corp.'s supply constraints due to limited capacity provided by Taiwan Semiconductor Manufacturing Co., its chosen chipmaker for advanced AI parts. Cadence, a leading semiconductor design software provider, is considering applying for funding from the USD 52 billion Chips and Science Act, which was passed to bring more of the global semiconductor supply chain within US borders.

Key takeaways:

  • Nvidia Corp's sophisticated chip packaging has helped it develop industry-leading AI accelerators, but limited suppliers are causing a bottleneck for the company.
  • Cadence Design Systems Inc.'s software plays a critical role in the global chip industry, with the US Department of Commerce putting export controls on design software for cutting-edge semiconductors to cut off China’s access to advanced technologies.
  • Cadence CEO Anirudh Devgan suggests the US should invest more in cutting-edge semiconductor packaging to ensure it leads in emerging technologies such as artificial intelligence.
  • Cadence is considering applying for funding from the USD 52 billion Chips and Science Act, which was passed to help bring more of the global semiconductor supply chain within US borders.
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