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Eliyan raises $60M for chiplet interconnects that speed up AI chips

Mar 26, 2024 - news.bensbites.co
Eliyan, a company specializing in chiplet interconnect technology, has raised $60 million in funding led by Samsung Catalyst Fund and Tiger Global Management. The funding will be used to address the challenges of developing generative AI chips and to continue focusing on the design and manufacturing of advanced AI chips that use multi-die architectures. The company's technology, which achieves up to four times the performance and half the power of other solutions, allows chip makers to connect multiple chiplets on the same device, addressing memory and IO wall constraints.

The company's NuLink PHY technology has been proven on advanced process nodes and addresses both Die-to-Die and Die-to-Memory interconnect with its highly efficient performance metrics. The additional investment follows the company’s $40 million Series A round in 2022 and will enable Eliyan to continue its focus on the most pressing challenges facing the design and manufacturing of advanced AI chips. The company's Universal Memory Interface (UMI) also addresses the growing challenge of memory capacity and bandwidth in AI chips.

Key takeaways:

  • Eliyan has raised $60 million in funding for its chiplet interconnect technology that speeds up the processing for AI chips.
  • The funding round was led by Samsung Catalyst Fund and Tiger Global Management to help address the challenges of development of generative AI chips.
  • Eliyan’s chiplet interconnect technology achieves up to four times the performance and half the power of other solutions.
  • The additional investment follows the company’s $40 million Series A round in 2022 and will enable Eliyan to continue its focus on the most pressing challenges facing the design and manufacturing of advanced AI chips.
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