JetCool's technology is already making an impact by enabling 30% faster processing while reducing energy consumption by 50% and water usage by 90% over air cooling. The company's cold plates are currently deployed at federal labs, improving efficiencies and saving water. Meanwhile, its self-contained solutions are deployed at colocations and financial institutions, resulting in energy savings and cooling next-generation chipsets at ambient temperatures over 95º F (35º C).
Key takeaways:
- JetCool Technologies, an MIT spinoff, has raised $17 million in a series A round of funding for its direct-to-chip liquid cooling technology for enterprise data centers.
- The company's patented microjet impingement technology, called microconvective liquid cooling, uses small fluid jets within compact cooling modules to cool high-power electronic chips.
- JetCool's technology has already made an impact by enabling 30% faster processing while reducing energy consumption by 50% and water usage by 90% over air cooling.
- With the new funding, JetCool plans to expand its cooling solutions to create sustained advancements in efficiency, performance, reliability, and sustainability for data centers, HPCs, and semiconductors.