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German Startup Semron Introduces Low-Cost, 3D-Scaled Chips for AI on Mobile Devices

Jan 30, 2024 - techtimes.com
Semron, a German startup, is pioneering the development of 3D-scaled chips that could revolutionize artificial intelligence (AI) on mobile devices. The chips, co-developed by Kai-Uwe Demasius and Aron Kirschen from the Dresden University of Technology, use memcapacitors and electrical fields for calculations, offering higher energy efficiency and lower production costs. This technology could be a game-changer for companies relying on AI computing resources.

The use of memcapacitors allows for the manipulation of electric fields, resulting in reduced energy usage and heat generation. Semron plans to stack hundreds of layers of memcapacitors on a single chip, increasing compute capacity. Despite being in the early stages and facing challenges such as mass manufacturing and building a customer base, Semron has secured 10 million euros in funding from investors and plans to expand its workforce.

Key takeaways:

  • Semron, a German startup, is developing 3D-scaled chips that could revolutionize AI on mobile devices. The chips use electrical fields for calculations, which is more energy-efficient and cost-effective than standard processors.
  • The chips use a component called a 'memcapacitor', which allows for the manipulation of electric fields and significantly reduces energy usage and heat generation.
  • In a study, Semron demonstrated that its technology could achieve energy efficiencies of over 3,500 TOPS/W, which is 35 to 300 times better than existing techniques.
  • Despite being in the early stages and facing challenges such as mass manufacturing and building a customer base, Semron has secured 10 million euros in funding and plans to expand its workforce.
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