Intel is facing stiff competition from Taiwan Semiconductor Manufacturing Co. (TSMC) and Samsung, which have overtaken Intel's technology lead. However, TSMC is also a partner, manufacturing most of the chiplets in Meteor Lake. Intel is also transforming its chipmaking business to become a "foundry" like TSMC and Samsung. The Meteor Lake's design, enabled by Intel's chiplet-stacking technology called Foveros, is seen as a sign of the future for the processor industry.
Key takeaways:
- Intel's Meteor Lake will feature a design that stacks multiple 'chiplets' into a single PC processor, including a super low-power CPU that can extend a laptop's battery life.
- The processor will include both high-performance CPU cores for demanding tasks and smaller efficiency cores for lower-priority work, with the ability to shuffle tasks between them for optimal results.
- Intel is under competitive pressure from Taiwan Semiconductor Manufacturing Co. (TSMC) and Samsung, but is also partnering with TSMC, which is manufacturing most of the chiplets inside Meteor Lake.
- Intel's new glass substrate technology, which offers better speed, power, and size advantages, paves the way for more advanced chiplet approaches in the future.