The Passage platform overcomes interconnect scaling constraints by using 3D integration of customer dies directly onto a silicon photonic interconnect, enabling optical I/O anywhere across the chip area. This provides higher connection density and bandwidth both within and outside the package. The partnership between Lightmatter and Amkor will deliver the industry’s largest multi-reticle die complex on an organic substrate within a 3D package, paving the way for the next major computing advances.
Key takeaways:
- Lightmatter, a leader in photonic supercomputing, has announced a strategic partnership with Amkor Technology, a leading provider of semiconductor packaging and test services, to create the largest-ever 3D-packaged chip complex using Lightmatter’s Passage™ platform.
- The collaboration aims to meet the unprecedented interconnect scaling and power demands of today's Artificial Intelligence (AI) workloads.
- The Passage platform overcomes shoreline constraints by using 3D integration of customer dies directly onto a silicon photonic interconnect, enabling optical I/O anywhere across the chip area.
- The combined expertise of Lightmatter and Amkor in photonics and 3D packaging has led to a breakthrough that unlocks unprecedented silicon density and bandwidth within a single package, paving the way for the next major computing advances, including AGI.