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Qualcomm unveils AI and connectivity chips at Mobile World Congress

Feb 26, 2024 - venturebeat.com
Qualcomm has unveiled a suite of AI, 5G, and Wi-Fi devices at the Mobile World Congress (MWC) in Barcelona, promising to usher in a new era of intelligent computing. The company's CEO, Cristiano Amon, emphasized the importance of on-device intelligence working in tandem with the cloud for greater personalization, privacy, reliability, and efficiency. The key highlights of Qualcomm’s MWC announcements include the Qualcomm AI Hub, on-device AI, AI PCs, the Snapdragon X80 5G Modem-RF System, and the Qualcomm FastConnect 7900.

The Qualcomm AI Hub features a library of over 75 pre-optimized AI models designed for seamless deployment on Snapdragon and Qualcomm platforms. On-device AI is starting to commercialize, with AI PC models arriving within a few months. The Snapdragon X80 5G Modem-RF System is touted as the world’s most advanced 5G modem-to-antenna platform, integrating 5G-Advanced capabilities. The Qualcomm FastConnect 7900 is the first mobile connectivity system to deliver AI-optimized performance and integrates Wi-Fi 7, Bluetooth, and Ultra Wideband technologies in a single chip.

Key takeaways:

  • Qualcomm unveiled a suite of AI, 5G, and Wi-Fi devices at Mobile World Congress (MWC) in Barcelona, promising to usher in a new era of intelligent computing.
  • The company introduced the Qualcomm AI Hub, featuring a new library of over 75 pre-optimized AI models for seamless deployment on Snapdragon and Qualcomm platforms.
  • Qualcomm also announced the Snapdragon X80 5G Modem-RF System, touted as the world’s most advanced 5G modem-to-antenna platform with fully integrated NB-NTN satellite communications support.
  • The Qualcomm FastConnect 7900, the first mobile connectivity system to deliver AI-optimized performance and integrate Wi-Fi 7, Bluetooth, and Ultra Wideband technologies in a single chip, was also unveiled.
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