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Samsung is reportedly turning to the same AI chipmaking technology as its rival

Mar 13, 2024 - qz.com
Samsung Electronics is reportedly shifting its chipmaking technology to match that of its competitor, SK Hynix, according to Reuters. Unlike SK Hynix, Samsung has not partnered with Nvidia, the world's largest AI chip firm, and has instead used non-conductive film (NCF) chipmaking technology. However, NCF has caused production issues, putting Samsung behind its rivals. SK Hynix uses the mass reflow molded underfill (MR-MUF) chipmaking method, and sources suggest Samsung has recently purchased technology to support this method.

Both Samsung and SK Hynix have ceased selling used chipmaking equipment on the secondary market due to U.S. export controls and sanctions on China and Russia. The equipment has been stored in warehouses since 2022 when the U.S. first imposed restrictions on advanced AI chips and semiconductor tool shipments to China. This move is part of a broader effort by the U.S. to slow China's progress with AI and military technology.

Key takeaways:

  • Samsung Electronics is reportedly adopting the chipmaking technology used by its competitor, SK Hynix, after facing production issues with its current non-conductive film (NCF) chipmaking technology.
  • Unlike its peers, Samsung has not made deals with Nvidia, the world’s biggest AI chip firm, to supply it with high bandwidth memory (HBM) chips.
  • Samsung and SK Hynix, leaders in memory chipmaking, have stopped selling used chipmaking equipment on the secondary market due to U.S. export controls and sanctions on China and Russia.
  • The U.S. has imposed restrictions on shipments of advanced AI chips and semiconductor tools to China since 2022, in an effort to slow China’s progress with AI and military technology.
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