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SK Hynix Commences Mass Production of Next Generation Memory Chip

Mar 19, 2024 - techbullion.com
SK Hynix Inc. has begun mass production of its next-generation high-bandwidth memory (HBM) chips, HBM3E, used in AI chipsets, according to a Reuters report. The new chip processes up to 1.18 terabytes of data per second and offers a 10% improvement in heat dissipation. The first shipment of the new chip is expected to go to Nvidia this month. Samsung Electronics and Micron Technology are also in the race, with Samsung claiming to have created the first 12-stack HBM3E chips and Micron announcing its mass production.

SK Hynix's dominant position in HBM chips has led to a doubling of its stock value over the past year. The company's HBM capacity is fully reserved until 2024 due to high demand for AI chipsets and the premium memory chips used in them. Meanwhile, Nvidia, which controls 80% of the AI chip market, has launched its new flagship processor, the B200, which is reportedly 30 times faster than its predecessor.

Key takeaways:

  • SK Hynix Inc. has begun mass production of the next-generation high-bandwidth memory (HBM) chips used in artificial intelligence chipsets.
  • The new HBM3E chip processes up to 1.18 terabytes of data per second and offers a 10% improvement in heat dissipation.
  • The first shipment of the new chip goes to Nvidia this month, making SK Hynix the market leader in the HBM chip space.
  • Due to its dominant position in HBM chips, SK Hynix’s stock value has doubled over the last 12 months.
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