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US To Reportedly Sanction 200 More Chinese Chip Firms - Slashdot

Nov 26, 2024 - news.slashdot.org
The U.S. is planning to impose new sanctions on approximately 200 Chinese chipmakers, potentially limiting the export of High Bandwidth Memory (HBM). This move is aimed at curbing China's progress in the semiconductor and AI sectors. The U.S. Department of Commerce is expected to enforce these regulations before November 28, with another round of sanctions targeting HBM exports scheduled for December.

The sanctions are already having an impact, with Huawei's Kirin SoCs and Ascend AI accelerators predicted to be stuck at 7nm technology until 2026 due to SMIC's inability to acquire advanced Extreme Ultraviolet (EUV) machines from ASML. Neither the Department of Commerce nor the Chamber of Commerce have responded to requests for comments on these developments.

Key takeaways:

  • The U.S. is planning to impose new sanctions on around 200 Chinese chipmakers, potentially restricting the export of High Bandwidth Memory (HBM).
  • This move is aimed at hindering China's advancements in the semiconductor and AI industries.
  • The US Department of Commerce is expected to push these new regulations before November 28, with another wave of sanctions set to follow in December.
  • These restrictions are already having an impact, with Huawei's Kirin SoCs and Ascend AI accelerators reportedly remaining at 7nm technology until 2026 due to SMIC's inability to procure cutting-edge Extreme Ultraviolet (EUV) machines from ASML.
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